The MediaTek Dimensity 9000 SoC has been unveiled as the latest flagship processor to take on Qualcomm’s top-tier Snapdragon chipset. It is the first mobile chipset to be manufactured on TSMC’s 4nm process and uses Arm’s new version 9 architecture. The MediaTek Dimensity 9000 SoC integrates a 10-core Arm Mali-G710 GPU and has a total of six fifth-generation APU cores for AI processing. The new flagship SoC also integrates a new 18-bit Imagick Gen 7 ISP which is claimed to be the world’s first to capture a 320-megapixel image. It also offers support for Wi-Fi 6E and Bluetooth v5.3.
company They say that the first smartphone is running mediatek The Dimensity 9000 SoC will arrive sometime in Q1 2022. The chipset uses the new Armv9 architecture CPUs which include one Arm Cortex-X2 clocked at 3.05GHz frequency, three Arm Cortex-A710 with 2.85GHz frequency and four Arm Cortex-A510 CPUs. , The chipset also comes with LPDDR5x 7500Mbps support.
As mentioned, the MediaTek Dimensity 9000 SoC features a flagship 18-bit HDR-ISP design that allows for HDR video capture on up to three cameras simultaneously. It also brings 320-megapixel camera support for the smartphone. The new six-core fifth-generation AI processing unit is said to bring a 4x power efficiency upgrade over the previous generation.
The MediaTek Dimensity 9000 SoC is powered by the latest ARM Mali-G710 graphics processor. The chipset is claimed to be the industry’s first reimplemented SDK using Vulkan for Android. It will also support full-HD+ display with 180Hz refresh rate. The Dimensity 9000 integrates only 5G smartphone modems with 3GPP Release-16 standard technology into the chip. It has an integrated 5G modem that offers up to 7Gbps in downlink, 3CC carrier aggregation (300MHz) and up to 300 percent faster uplink performance.
Connectivity options with the MediaTek Dimensity 9000 SoC include Bluetooth 5.3 standard, Wi-Fi 6E 2×2, wireless stereo audio, and Beidou III-B1 C GNSS support.